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Equipment Angency
Semicon Equipment Maintenance Service
 
 
   聚焦离子束应用 →
Circuit Modification
Probing Pad Building
Cross section
测试键生长
FIB Application Range B
测试键生长（Test Pad/Probing Pad Building）
在复杂线路中任意位置镀出测试键, 工程师可进一步使用探针台(Probe station) 或 E-beam 直接观测IC内部信号.
----Direct Probing
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